웨지 와이어 본더 장치
Submitted by rnd_admin on Tue, 10/22/2024 - 00:10
ename_ko:
웨지 와이어 본더 장치
ename_en:
Wedge Wire Bonder
emodel:
7476D-79
institution:
응용물리연구소
location:
관악 자연과학관2
(19동 406호)
epname:
김영찬
tel:
02-871-7104
email:
kyc1607@snu.ac.kr
link:
https://iap.snu.ac.kr/equipment/list?cateidx=19
keyword:
- Manual Wire Bonder
- Two way convertibility : Deep Access (90° wedge Ribbon) Conventional (45° wedge)
- Application : LD array PD array chip package MMIC hybrid IC etc...
- Control Logic : Motorola 68000 microprocessor
- Memory : battery back-up RAM
- Data Entry : Selector switch
- Z tool range : 0.5 inch
- Z encoder resolution : 0.002 inch
- Bond force range : Adjustable 10 to 150 grams
- Transducer : 1/2 wave 63 KHz (nominal)
- Throat reach : 5.125 inch
- Ultrasonics : Built-in 8 bit 4 watts (Ultrasonic positioning utility)
- Wire range : 0.7 to 2.0 mils 1×10 mil gold ribbon (7600D)
- ESD Protection : protection against electrostatic discharge
- Display : 4 line 40 character LCD
- Conventional tool length : 0.750 inch (7400D)
- Deep Access tool length : 0.750 inch (7600D)
- Micromanipulator : Dual counterbalanced single lever 8:1 ratio
- Wire spool mount : 0.5 inch with ball bearing rollers
- Radiant tool heat : Built-in
- Microscope : Selection available (ESD types available)
- Illuminator : Selection available (ESD types available)
- Work holders : Wide selection plus custom fabrication services
code:
iap19_wire bonder